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8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER ’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
BILL OF MATERIALS
Qty
1
Reference
PCB 103-00050
Description
SOT23 Evaluation Board PCB
Manufacturer
Microchip
Part Number
103-00060
Technology Inc.
0
U1
SOIC-8 Device
Microchip
User-specified
Technology Inc.
0
U2
MSOP-8 Device
Microchip
User-specified
Technology Inc.
0
U3
DIP-8 Device
Microchip
User-specified
Technology Inc.
0
U4
TSSOP-8 Device
Microchip
User-specified
Technology Inc.
0
C1, C2, C3
Device Power Supply Bypass Capacitor
—
User-specified
Surface-mount (805 package)
(Optional - Application-dependent)
0
C1A, C1B, C1C,
Output Filer Capacitor
—
User-specified
C1D, C1E, C1F,
C1G, C1H
Surface-mount (805 package)
(Optional - Application-dependent)
0
R1A, R1B, R1C,
Output inline resistor
—
User-specified
R1D, R1E, R1F,
R1G, R1H
Surface-mount (805 package)
(Optional - Application-dependent)
0
R2A, R2B, R2C,
Output Pull-up resistor
—
User-specified
R2D, R2E, R2F,
R2G, R2H
Surface-mount (805 package)
(Optional - Application-dependent)
0
R3A, R3B, R3C,
Output Pull-down resistor
—
User-specified
R3D, R3E, R3F,
R3G, R3H
Surface-mount (805 package)
(Optional - Application-dependent)
0
P1, P2, P3, P4 Passive component (not connected) that can be
“blue wired” into the desired circuit. The device
layout supports the 805 package.
(Optional - Application-dependent)
0
0
J1 BFMP Header (6-pin, 100 mil spacing)
PAD1, PAD2, PAD3, Through-hole connector(s) for PAD1, PAD2,
PAD4, PAD5, PAD6, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V DD ,
V SS
PAD7, PAD8,
—
Keystone
Electronics ?
—
5012
V DD , V SS
0
PAD1, PAD2, PAD3, Surface-mount connector(s) for PAD1, PAD2,
PAD4, PAD5, PAD6, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V DD ,
PAD7, PAD8,
V SS
Keystone
Electronics ?
5016
V DD , V SS
? 2005 Microchip Technology Inc.
DS51544A-page 27
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